HDB-M4 Series
Manufacturer: Amphenol Aerospace Operations
MOTHER BOARD 80POS
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Current Rating | Mounting Type | Number of Columns | Number of Positions | Contact Finish Thickness | Number of Rows | Features | Color | Connector Type | Number of Positions Loaded | Termination | Connector Style | Pitch | Connector Usage | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 80 | 30 µin | 8 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 60 | 30 µin | 6 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 120 | 30 µin | 12 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 80 | 30 µin | 8 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 120 | 100 µin | 12 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Tin-Lead |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 60 | 30 µin | 6 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 80 | 30 µin | 8 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 120 | 30 µin | 12 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Gold |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 80 | 100 µin | 8 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Tin-Lead |
Amphenol Aerospace Operations | 125 °C | -65 °C | 2 A | Through Hole | 10 | 60 | 100 µin | 6 | Jackscrew | Black | Female Sockets Receptacle | All | Solder | High Density (HDC HDI HPC) | 0.07 in | Backplane Motherboard | Tin-Lead |