MOTHER BOARD 80POS
| Part | Color | Number of Positions | Mounting Type | Termination | Connector Type | Features | Current Rating (Amps) | Connector Style | Connector Usage | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions Loaded | Contact Finish | Number of Columns | Contact Finish Thickness | Contact Finish Thickness | Number of Rows | Pitch [x] | Pitch [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol Aerospace Operations | Black | 80 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 8 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 60 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 6 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 120 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 12 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 80 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 8 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 120 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Tin-Lead | 10 | 2.54 µm | 100 µin | 12 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 60 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 6 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 80 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Gold | 10 | 0.76 Ám | 30 Áin | 8 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 80 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Tin-Lead | 10 | 2.54 µm | 100 µin | 8 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 60 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Tin-Lead | 10 | 2.54 µm | 100 µin | 6 | 0.07 in | 1.78 mm |
Amphenol Aerospace Operations | Black | 120 | Through Hole | Solder | Receptacle Female Sockets | Jackscrew | 2 A | High Density (HDC HDI HPC) | Backplane Motherboard | 125 °C | -65 ░C | All | Tin-Lead | 10 | 2.54 µm | 100 µin | 12 | 0.07 in | 1.78 mm |