232 Series

Manufacturer: 3M

Catalog

TAPE MASKING TAN 15/16"X60YDS

Part	Shelf Life	Usage	Color	Adhesive	Storage/Refrigeration Temperature	Storage/Refrigeration Temperature	Tape Type	Shelf Life Start	Thickness	Thickness	Thickness	Backing, Carrier	Length	Length	Length	Current Rating (Amps)	Termination	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Mating	Type	Mounting Type	Material Flammability Rating	Pitch - Post	Pitch - Post	Features	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Post	Contact Resistance	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Number of Pins	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Width [x]	Width [x]	Number of Positions or Pins (Grid)	Width [y]	Width [y]
3M 232-24MM-55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft
3M 232-1270-01-0602																1 A	Solder	Polysulfone (PSU), Glass Filled	2 x 16	32	30 Áin	0.76 Ám	30 µin	0.76 µm	3.9 mm	0.154 in	Beryllium Copper	PGA, ZIF (ZIP)	Through Hole	UL94 V-0	2.54 mm	0.1 in	Closed Frame	-55 °C	125 °C	Gold	Beryllium Copper	25 mOhm	0.1 in	2.54 mm	Gold
3M 232-1285-19-0602J																1 A	Wire Wrap	Polysulfone (PSU), Glass Filled			30 Áin	0.76 Ám	30 µin	0.76 µm	15.75 mm	0.62 in	Beryllium Copper		Through Hole	UL94 V-0	2.54 mm	0.1 in	Closed Frame	-55 °C	125 °C	Gold	Beryllium Copper		0.1 in	2.54 mm	Gold	0.6 in	DIP	15.24 mm	32	15.24 mm	DIP	0.6 in
3M 232-1271-00-1102JH																																						25 mOhm
3M 232-36MMX55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft																																		1.42 in	36 mm
3M 232-1270-51-0602																																						25 mOhm
3M 232-1270-02-0602																1 A	Solder	Polysulfone (PSU), Glass Filled	2 x 16	32	30 Áin	0.76 Ám	30 µin	0.76 µm	3.9 mm	0.154 in	Beryllium Copper	PGA, ZIF (ZIP)	Through Hole	UL94 V-0	2.54 mm	0.1 in	Closed Frame	-55 °C	125 °C	Gold	Beryllium Copper	25 mOhm	0.1 in	2.54 mm	Gold
3M 232-5205-01																	Solder	Polyethersulfone (PES)							2.9 mm	0.114 in	Beryllium Copper	QFN	Through Hole				Closed Frame			Gold	Beryllium Copper	25 mOhm			Gold										32
3M 232-96MMX55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft																																		3.78 "	96 mm
3M 232-48MM-55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft																																					48 mm	1.89 in