232-5205-01

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IC & COMPONENT SOCKET, 32 CONTACTS, QFN TEST SOCKET, 0.5 MM, 232 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Technical Data Sheet EN +2

232-5205-01

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IC & COMPONENT SOCKET, 32 CONTACTS, QFN TEST SOCKET, 0.5 MM, 232 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Technical Data Sheet EN +2

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 116.18
		10	$ 106.62
		25	$ 102.52
		50	$ 99.10
		100	$ 93.63
Newark	Each	1	$ 131.92

Description

General part information

232 Series

The 232-5205-01 is a 32-way 0.5mm through-hole vertical Open-Top Test Socket with gold-plated beryllium copper contacts for QFN applications. This 232 series even row socket is compatible with most robotic handlers and accommodates 0.4mm pitches.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Technical Data Sheet EN

Datasheet

232-5205 Pin Map

Datasheet

Specification	232-5205-01	232 Series

Adhesive	-	Rubber
Backing, Carrier	-	Crepe Paper, Treated, Paper
Color	-	Tan
Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	-	30 Áin
Contact Finish Thickness - Mating	-	0.76 Ám
Contact Finish Thickness - Post	-	30 µin
Contact Finish Thickness - Post	-	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	25 mOhm	15 - 25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	DIP
Convert To (Adapter End)	-	15.24 mm
Current Rating (Amps)	-	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polyethersulfone (PES)	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES)
Length	-	60 yds
Length	-	55 m
Length	-	180 ft
Material Flammability Rating	-	UL94 V-0
Mounting Type	Through Hole	Connector, Through Hole
Number of Pins	-	32
Number of Positions or Pins (Grid)	32	32
Number of Positions or Pins (Grid)	-	2 x 16, 1 x 32
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid)	-	32
Operating Temperature	-	-55 °C
Operating Temperature	-	125 °C
Pitch - Mating	-	0.1 in
Pitch - Mating	-	2.54 mm
Pitch - Post	-	2.54 mm
Pitch - Post	-	0.1 in
Shelf Life	-	12 Months
Shelf Life Start	-	Date of Manufacture
Storage/Refrigeration Temperature	-	70 °F
Storage/Refrigeration Temperature	-	21 °C
Tape Type	-	Masking
Termination	Solder	Press-Fit, Solder, Wire Wrap
Termination Post Length	-	0.11 - 0.13 in
Termination Post Length	-	2.78 - 3.3 mm
Termination Post Length [x]	2.9 mm	2.9 - 15.75 mm
Termination Post Length [x]	0.114 in	0.114 - 0.62 in
Thickness	-	6.3 mils
Thickness	-	0.0063 "
Thickness	-	0.16 mm
Type	QFN	DIP, ZIF (ZIP), ZIF (ZIP), PGA, QFN, SIP
Type	-	15.24 mm
Type	-	0.6 "
Usage	-	Medium Temp, Paint Bake
Width	-	48 - 72 mm
Width	-	1.89 - 2.83 "
Width	-	0.47 - 3.78 in
Width	-	12 - 96 mm

Part

Shelf Life

Usage

Color

Adhesive

Storage/Refrigeration Temperature

Tape Type

Shelf Life Start

Thickness

Backing, Carrier

Length

Width [y]

Contact Resistance

Width [x]

Contact Finish - Post

Contact Finish Thickness - Mating

Termination

Material Flammability Rating

Contact Material - Mating

Type

Pitch - Mating

Number of Positions or Pins (Grid) [custom]

Contact Material - Post

Pitch - Post

Contact Finish - Mating

Contact Finish Thickness - Post

Housing Material

Mounting Type

Current Rating (Amps)

Operating Temperature [Min]

Operating Temperature [Max]

Termination Post Length

Features

Termination Post Length [x]

Number of Positions or Pins (Grid)

Number of Positions or Pins (Grid) [custom]

Convert To (Adapter End)

Number of Pins

Convert From (Adapter End)

232-24MM-55M

12 Months

Medium Temp, Paint Bake

Tan

Rubber

70 °F

21 °C

Masking

Date of Manufacture

6.3 mils

0.0063 "

0.16 mm

Crepe Paper, Treated

60 yds

55 m

180 ft

232-72MMX55M

12 Months

Tan

Rubber

70 °F

21 °C

Masking

Date of Manufacture

6.3 mils

0.0063 "

0.16 mm

Paper

60 yds

55 m

180 ft

72 mm

2.83 "

232-1271-00-1102JH

25 mOhm

232-36MMX55M

12 Months

Medium Temp, Paint Bake

Tan

Rubber

70 °F

21 °C

Masking

Date of Manufacture

6.3 mils

0.0063 "

0.16 mm

Crepe Paper, Treated

60 yds

55 m

180 ft

1.42 in

36 mm

232-1270-51-0602

25 mOhm

232-18MMX55M

12 Months

Medium Temp, Paint Bake

Tan

Rubber

70 °F

21 °C

Masking

Date of Manufacture

6.3 mils

0.0063 "

0.16 mm

Crepe Paper, Treated

60 yds

55 m

180 ft

0.71 in

18 mm

232-1287-00-0602J

15 mOhm

Gold

30 Áin

0.76 Ám

Press-Fit

UL94 V-0

Beryllium Copper

15.24 mm

DIP, ZIF (ZIP)

0.6 "

0.1 in

2.54 mm

2 x 16

Beryllium Copper

2.54 mm

0.1 in

Gold

30 µin

0.76 µm

Polysulfone (PSU), Glass Filled

Connector

1 A

-55 °C

125 °C

0.11 in

2.78 mm

Closed Frame

232-1285-00-0602J

Gold

30 Áin

0.76 Ám

Press-Fit

UL94 V-0

Beryllium Copper

15.24 mm

DIP, ZIF (ZIP)

0.6 "

0.1 in

2.54 mm

2 x 16

Beryllium Copper

2.54 mm

0.1 in

Gold

30 µin

0.76 µm

Polysulfone (PSU), Glass Filled

Connector

1 A

-55 °C

125 °C

0.11 in

2.78 mm

Closed Frame

232-1270-02-0602

25 mOhm

Gold

30 Áin

0.76 Ám

Solder

UL94 V-0

Beryllium Copper

PGA, ZIF (ZIP)

0.1 in

2.54 mm

2 x 16

Beryllium Copper

2.54 mm

0.1 in

Gold

30 µin

0.76 µm

Polysulfone (PSU), Glass Filled

Through Hole

1 A

-55 °C

125 °C

Closed Frame

3.9 mm

0.154 in

232-5205-01

25 mOhm

Gold

Solder

Beryllium Copper

QFN

Beryllium Copper

Gold

Polyethersulfone (PES)

Through Hole

Closed Frame

2.9 mm

0.114 in

Part	Shelf Life	Usage	Color	Adhesive	Storage/Refrigeration Temperature	Storage/Refrigeration Temperature	Tape Type	Shelf Life Start	Thickness	Thickness	Thickness	Backing, Carrier	Length	Length	Length	Width [y]	Width [y]	Contact Resistance	Width [x]	Width [x]	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Material Flammability Rating	Contact Material - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Mounting Type	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Termination Post Length	Features	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid)
3M 232-24MM-55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft
3M 232-72MMX55M	12 Months		Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Paper	60 yds	55 m	180 ft	72 mm	2.83 "
3M 232-1271-00-1102JH																		25 mOhm
3M 232-36MMX55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft				1.42 in	36 mm
3M 232-1270-51-0602																		25 mOhm
3M 232-18MMX55M	12 Months	Medium Temp, Paint Bake	Tan	Rubber	70 °F	21 °C	Masking	Date of Manufacture	6.3 mils	0.0063 "	0.16 mm	Crepe Paper, Treated	60 yds	55 m	180 ft				0.71 in	18 mm
3M 232-1287-00-0602J																		15 mOhm			Gold	30 Áin	0.76 Ám	Press-Fit	UL94 V-0	Beryllium Copper	15.24 mm	DIP, ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	2 x 16	32	Beryllium Copper	2.54 mm	0.1 in	Gold	30 µin	0.76 µm	Polysulfone (PSU), Glass Filled	Connector	1 A	-55 °C	125 °C	0.11 in	2.78 mm	Closed Frame
3M 232-1285-00-0602J																					Gold	30 Áin	0.76 Ám	Press-Fit	UL94 V-0	Beryllium Copper	15.24 mm	DIP, ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	2 x 16	32	Beryllium Copper	2.54 mm	0.1 in	Gold	30 µin	0.76 µm	Polysulfone (PSU), Glass Filled	Connector	1 A	-55 °C	125 °C	0.11 in	2.78 mm	Closed Frame
3M 232-1270-02-0602																		25 mOhm			Gold	30 Áin	0.76 Ám	Solder	UL94 V-0	Beryllium Copper		PGA, ZIF (ZIP)		0.1 in	2.54 mm	2 x 16	32	Beryllium Copper	2.54 mm	0.1 in	Gold	30 µin	0.76 µm	Polysulfone (PSU), Glass Filled	Through Hole	1 A	-55 °C	125 °C			Closed Frame	3.9 mm	0.154 in
3M 232-5205-01																		25 mOhm			Gold			Solder		Beryllium Copper		QFN						Beryllium Copper			Gold			Polyethersulfone (PES)	Through Hole						Closed Frame	2.9 mm	0.114 in	32

232-5205-01

Deep-Dive with AI

232-5205-01

Deep-Dive with AI

Pricing

Description

232 Series

Documents

Technical Data Sheet EN

Technical Data Sheet EN

232-5205 Pin Map

Datasheet

Technical Specifications

232 Series