CONN PCI EXP FMALE 98POS 0.039
| Part | Read Out | Color | Mounting Type | Contact Finish | Card Thickness | Card Thickness | Contact Material | Features | Contact Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness | Card Type | Gender | Termination | Number of Positions | Pitch [x] | Pitch [x] | Number of Rows | Material - Insulation | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) 10018783-10212TLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | Flash | PCI Express™ | Female | Solder, Staggered | 98 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | ||
Amphenol ICC (FCI) 10018783-10203TLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | Flash | PCI Express™ | Female | Solder, Staggered | 164 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | ||
Amphenol ICC (FCI) 10018783-11000TLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Lock, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 36 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin | |
Amphenol ICC (FCI) 10018783-10213TLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | Flash | PCI Express™ | Female | Solder, Staggered | 164 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | ||
Amphenol ICC (FCI) 10018783-10000ALF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Lock, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 36 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin | |
Amphenol ICC (FCI) 10018783-00002MLF | Dual | White | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 98 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin | |
Amphenol ICC (FCI) 10018783-10202MLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 98 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin | |
Amphenol ICC (FCI) 10018783-00113TLF | Dual | White | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 164 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin | |
Amphenol ICC (FCI) 10018783-11121TLF | Dual | Black | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Lock, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 64 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.38 µm | 15 µin | |
Amphenol ICC (FCI) 10018783-00200MLF | Dual | White | Through Hole | Gold | 0.062 in | 1.57 mm | Copper Alloy | Board Guide, Locking Ramp | Cantilever | 85 °C | -55 °C | PCI Express™ | Female | Solder, Staggered | 36 | 0.039 in | 1 mm | 2 | Glass Filled, Nylon, Polyamide (PA) | 0.76 Ám | 30 Áin |