10018783-00113TLF

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Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

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10018783-00113TLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

Deep-Dive with AI

DocumentsDatasheet gs-12-233 Other Related Document

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	20700	$ 1.20

Description

General part information

10018783 Series

164 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) White

Documents

Technical documentation and resources

Datasheet

gs-12-233 Other Related Document

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	10018783-00113TLF	10018783 Series

Card Thickness	0.062 in	0.062 in
Card Thickness	1.57 mm	1.57 mm
Card Type	PCI Express™	PCI Express™
Color	White	Black, White, Natural
Contact Finish	Gold	Gold
Contact Finish Thickness	0.76 Ám	0.38 - 0.76 µm
Contact Finish Thickness	30 Áin	15 - 30 µin
Contact Finish Thickness	-	Flash
Contact Material	Copper Alloy	Copper Alloy
Contact Type	Cantilever	Cantilever
Features	Locking Ramp, Board Guide	Locking Ramp, Board Lock, Board Guide
Gender	Female	Female
Material - Insulation	Polyamide (PA), Glass Filled, Nylon	Polyamide (PA), Glass Filled, Nylon
Mounting Type	Through Hole	Through Hole
Number of Positions	164	36 - 164
Number of Positions/Bay/Row	-	21
Number of Positions/Bay/Row	-	11
Number of Positions/Bay/Row	-	71
Number of Positions/Bay/Row	-	11
Number of Rows	2	2
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch [x]	0.039 in	0.039 in
Pitch [x]	1 mm	1 mm
Read Out	Dual	Dual
Termination	Solder, Staggered	Solder, Staggered
Termination Rows	-	2

10018783 Series

CONN PCI EXP FMALE 164POS 0.039

...

Part	Termination	Contact Type	Number of Rows	Mounting Type	Contact Material	Number of Positions	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness	Contact Finish Thickness	Pitch [x]	Pitch [x]	Gender	Read Out	Material - Insulation	Features	Card Type	Contact Finish	Color	Card Thickness	Card Thickness	Contact Finish Thickness
Amphenol ICC (FCI) 10018783-10103ZLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-12100TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-00203TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	White	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11123TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10033ELF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11112MLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	98	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11120TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10212TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	98	85 °C	-55 °C			0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm	Flash
Amphenol ICC (FCI) 10018783-00013TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Natural	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10000TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm