10018783-10203TLF

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Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

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10018783-10203TLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 164POS 0.039

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DocumentsDatasheet cardedge productpresentation Other Related Document +1

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 1.57
		10	$ 1.19
		25	$ 1.00
		40	$ 0.98
		80	$ 0.94
		230	$ 0.83
		440	$ 0.78
		945	$ 0.72
		2400	$ 0.66

Description

General part information

10018783 Series

164 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black

Documents

Technical documentation and resources

Datasheet

cardedge productpresentation Other Related Document

gs-12-233 Other Related Document

Related Document

Specification	10018783-10203TLF	10018783 Series

Card Thickness	0.062 in	0.062 in
Card Thickness	1.57 mm	1.57 mm
Card Type	PCI Express™	PCI Express™
Color	Black	Black, White, Natural
Contact Finish	Gold	Gold
Contact Finish Thickness	Flash	Flash
Contact Finish Thickness	-	15 - 30 µin
Contact Finish Thickness	-	0.38 - 0.76 µm
Contact Material	Copper Alloy	Copper Alloy
Contact Type	Cantilever	Cantilever
Features	Locking Ramp, Board Guide	Locking Ramp, Board Lock, Board Guide
Gender	Female	Female
Material - Insulation	Polyamide (PA), Glass Filled, Nylon	Polyamide (PA), Glass Filled, Nylon
Mounting Type	Through Hole	Through Hole
Number of Positions	164	36 - 164
Number of Positions/Bay/Row	-	21
Number of Positions/Bay/Row	-	11
Number of Positions/Bay/Row	-	71
Number of Positions/Bay/Row	-	11
Number of Rows	2	2
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch [x]	0.039 in	0.039 in
Pitch [x]	1 mm	1 mm
Read Out	Dual	Dual
Termination	Solder, Staggered	Solder, Staggered
Termination Rows	-	2

Part

Termination

Contact Type

Number of Rows

Mounting Type

Contact Material

Number of Positions

Operating Temperature [Max]

Operating Temperature [Min]

Contact Finish Thickness

Pitch [x]

Gender

Read Out

Material - Insulation

Features

Card Type

Contact Finish

Color

Card Thickness

Contact Finish Thickness

Number of Positions/Bay/Row [custom]

Termination Rows

Number of Positions/Bay/Row [custom]

Amphenol ICC (FCI)

10018783-10103ZLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

164

85 °C

-55 °C

15 µin

0.38 µm

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Lock, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-12100TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

85 °C

-55 °C

30 Áin

0.76 Ám

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Guide, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-00203TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

164

85 °C

-55 °C

30 Áin

0.76 Ám

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Guide, Locking Ramp

PCI Express™

Gold

White

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-11123TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

164

85 °C

-55 °C

15 µin

0.38 µm

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Lock, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-10033ELF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

164

85 °C

-55 °C

30 Áin

0.76 Ám

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Guide, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-11112MLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

85 °C

-55 °C

15 µin

0.38 µm

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Lock, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-11120TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

85 °C

-55 °C

15 µin

0.38 µm

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Lock, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-10212TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

85 °C

-55 °C

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Guide, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Flash

Amphenol ICC (FCI)

10018783-00013TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

164

85 °C

-55 °C

30 Áin

0.76 Ám

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Lock, Locking Ramp

PCI Express™

Gold

Natural

0.062 in

1.57 mm

Amphenol ICC (FCI)

10018783-10000TLF

Solder, Staggered

Cantilever

Through Hole

Copper Alloy

85 °C

-55 °C

30 Áin

0.76 Ám

0.039 in

1 mm

Female

Dual

Glass Filled, Nylon, Polyamide (PA)

Board Guide, Locking Ramp

PCI Express™

Gold

Black

0.062 in

1.57 mm

Part	Termination	Contact Type	Number of Rows	Mounting Type	Contact Material	Number of Positions	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness	Contact Finish Thickness	Pitch [x]	Pitch [x]	Gender	Read Out	Material - Insulation	Features	Card Type	Contact Finish	Color	Card Thickness	Card Thickness	Contact Finish Thickness
Amphenol ICC (FCI) 10018783-10103ZLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-12100TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-00203TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	White	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11123TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10033ELF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11112MLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	98	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-11120TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	15 µin	0.38 µm	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10212TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	98	85 °C	-55 °C			0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm	Flash
Amphenol ICC (FCI) 10018783-00013TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	164	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Lock, Locking Ramp	PCI Express™	Gold	Natural	0.062 in	1.57 mm
Amphenol ICC (FCI) 10018783-10000TLF	Solder, Staggered	Cantilever	2	Through Hole	Copper Alloy	36	85 °C	-55 °C	30 Áin	0.76 Ám	0.039 in	1 mm	Female	Dual	Glass Filled, Nylon, Polyamide (PA)	Board Guide, Locking Ramp	PCI Express™	Gold	Black	0.062 in	1.57 mm

10018783-10203TLF

Deep-Dive with AI

10018783-10203TLF

Deep-Dive with AI

Pricing

Description

10018783 Series

Documents

Datasheet

cardedge productpresentation Other Related Document

gs-12-233 Other Related Document

Technical Specifications

10018783 Series