CSD95378 Series
60A Synchronous Buck NexFET™ Smart Power Stage with TAO offset and DualCool™ package
Manufacturer: Texas Instruments
Catalog(3 parts)
Part | Mounting Type | Applications | Package / Case | Technology | Load Type | Features | Voltage - Load▲▼ | Voltage - Load▲▼ | Fault Protection | Supplier Device Package | Operating Temperature▲▼ | Operating Temperature▲▼ | Voltage - Supply▲▼ | Voltage - Supply▲▼ | Interface | Current - Output / Channel▲▼ |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments CSD95378BQ5MTHalf Bridge Driver Synchronous Buck Converters Power MOSFET 12-LSON-CLIP (5x6) | Surface Mount | Synchronous Buck Converters | 12-PowerLFDFN | Power MOSFET | Inductive | Bootstrap Circuit, Status Flag | 4.5 V | 16 V | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO | 12-LSON-CLIP (5x6) | 150 °C | -55 °C | 5.5 V | 4.5 V | PWM | 60 A |
Texas Instruments CSD95378BQ5MHalf Bridge Driver Synchronous Buck Converters Power MOSFET 12-LSON-CLIP (5x6) | Surface Mount | Synchronous Buck Converters | 12-PowerLFDFN | Power MOSFET | Inductive | Bootstrap Circuit, Status Flag | 4.5 V | 16 V | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO | 12-LSON-CLIP (5x6) | 150 °C | -55 °C | 5.5 V | 4.5 V | PWM | 60 A |
Texas Instruments CSD95378BQ5MCHalf Bridge Driver Synchronous Buck Converters Power MOSFET 12-VSON (5x6) | Surface Mount | Synchronous Buck Converters | 12-PowerTFDFN | Power MOSFET | Inductive | Bootstrap Circuit, Status Flag | 4.5 V | 16 V | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO | 12-VSON | 150 °C | -55 °C | 5.5 V | 4.5 V | PWM | 60 A |
Key Features
• 60-A Continuous Operating Current Capability93.4% System Efficiency at 30 ALow-Power Loss of 2.8 W at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation Mode With FCCMTemperature Compensated Bidirectional Current SenseAnalog Temperature Output (400 mV at 0°C)Fault MonitoringHigh-Side Short, Overcurrent, and Overtemperature Protection3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap DiodeOptimized Dead Time for Shoot-Through ProtectionHigh-Density SON 5-mm × 6-mm FootprintUltra-Low-Inductance PackageSystem-Optimized PCB FootprintDualCool™ PackagingRoHS Compliant – Lead-Free Terminal PlatingHalogen-Free60-A Continuous Operating Current Capability93.4% System Efficiency at 30 ALow-Power Loss of 2.8 W at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation Mode With FCCMTemperature Compensated Bidirectional Current SenseAnalog Temperature Output (400 mV at 0°C)Fault MonitoringHigh-Side Short, Overcurrent, and Overtemperature Protection3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap DiodeOptimized Dead Time for Shoot-Through ProtectionHigh-Density SON 5-mm × 6-mm FootprintUltra-Low-Inductance PackageSystem-Optimized PCB FootprintDualCool™ PackagingRoHS Compliant – Lead-Free Terminal PlatingHalogen-Free
Description
AI
The CSD95378BQ5MC NexFET™ smart power stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.
The CSD95378BQ5MC NexFET™ smart power stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.