MASTERGAN2 Series

High power density 600V Half bridge driver with two enhancement mode GaN HEMTs

Catalog

High power density 600V Half bridge driver with two enhancement mode GaN HEMTs

Part	Applications	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Package / Case	Voltage - Supply [Min]	Voltage - Supply [Max]	Supplier Device Package	Technology	Voltage - Load [Max]	Load Type	Rds On (Typ)	Current - Peak Output	Current - Output / Channel	Fault Protection	Features
STMicroelectronics MASTERGAN2	Power Supplies	125 °C	-40 °C	Surface Mount	31-VQFN Exposed Pad	3.3 V	15 V	31-QFN (9x9)
STMicroelectronics MASTERGAN2TR	General Purpose	125 ¯C	-40 °C	Surface Mount	31-VQFN Exposed Pad	4.75 V	4.75 V	31-QFN (9x9)	DMOS	600 V	Capacitive Inductive	150 mOhm 225 mOhm	17 A	6.5 A 10 A	Over Temperature UVLO	Bootstrap Circuit

Catalog

High power density 600V Half bridge driver with two enhancement mode GaN HEMTs

Key Features

• 600 V system-in-package integrating half-bridge gate driver and high-voltage power GaN transistors in asymmetrical configuration:

- QFN 9 x 9 x 1 mm package

- RDS(ON)= 150 mΩ (LS) + 225 mΩ (HS)

- IDS(MAX)= 10 A (LS) + 6.5 A (HS)

Description

The MASTERGAN2 is an advanced power system-in-package integrating a gate driver and two enhancement mode GaN transistors in asymmetrical half‑bridge configuration. The integrated power GaNs have 650 V drain‑source blocking voltage and RDS(ON)of 150 mΩ and 225 mΩ for Low side and High side respectively, while the high side of the embedded gate driver can be easily supplied by the integrated bootstrap diode. The MASTERGAN2 features UVLO protection on both the lower and upper driving sections, preventing the power switches from operating in low efficiency or dangerous conditions, and the interlocking function avoids cross-conduction conditions. The input pins extended range allows easy interfacing with microcontrollers, DSP units or Hall effect sensors. The MASTERGAN2 operates in the industrial temperature range, -40°C to 125°C. The device is available in a compact 9x9 mm QFN package.