SM320F28335-EP Series
C2000™ Enhanced Product 32-bit MCU with 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
C2000™ Enhanced Product 32-bit MCU with 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC
| Part | Speed | Number of I/O | RAM Size | Core Processor | Data Converters | Operating Temperature [Min] | Operating Temperature [Max] | Package / Case | Oscillator Type | Core Size | Supplier Device Package | Mounting Type | Program Memory Type | Program Memory Size | Peripherals |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments SM320F28335PTPMEP | 150 MHz | 88 | 34 K | C28x | 12 b, 16 | -55 C | 125 °C | 176-LQFP Exposed Pad | Internal | 32-Bit Single-Core | 176-HLQFP (24x24) | Surface Mount | FLASH | 512 KB | DMA, POR, PWM, WDT |
Texas Instruments SM320F28335GJZMEP | 150 MHz | 88 | 34 K | C28x | 12 b, 16 | -55 C | 125 °C | 176-BGA | Internal | 32-Bit Single-Core | 176-BGA (15x15) | Surface Mount | FLASH | 512 KB | DMA, POR, PWM, WDT |
Key Features
• High-Performance Static CMOS TechnologyUp to 150 MHz (6.67-ns Cycle Time)1.9-V/1.8-V Core, 3.3-V I/O DesignHigh-Performance 32-Bit CPUIEEE-754 Single-Precision Floating-Point Unit (FPU)16 x 16 and 32 x 32 MAC Operations16 x 16 Dual MACHarvard Bus ArchitectureFast Interrupt Response and ProcessingUnified Memory Programming ModelCode-Efficient (in C/C++ and Assembly)Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)Over 2M x 16 Address ReachOn-Chip Memory256K x 16 Flash, 34K x 16 SARAM1K x 16 OTP ROMBoot ROM (8K x 16)With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)Standard Math TablesClock and System ControlDynamic PLL Ratio Changes SupportedOn-Chip OscillatorWatchdog Timer ModuleGPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core InterruptsPeripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts128-Bit Security Key/LockProtects Flash/OTP/RAM BlocksPrevents Firmware Reverse EngineeringEnhanced Control PeripheralsUp to 18 PWM OutputsUp to 6 HRPWM Outputs With 150 ps MEP ResolutionUp to 6 Event Capture InputsUp to 2 Quadrature Encoder InterfacesUp to 8 32-bit/Nine 16-bit TimersThree 32-Bit CPU TimersSerial Port PeripheralsUp to 2 CAN ModulesUp to 3 SCI (UART) ModulesUp to 2 McBSP Modules (Configurable as SPI)One SPI ModuleOne Inter-Integrated-Circuit (I2C) Bus12-Bit ADC, 16 Channels80-ns Conversion Rate2 x 8 Channel Input MultiplexerTwo Sample-and-HoldSingle/Simultaneous ConversionsInternal or External ReferenceUp to 88 Individually Programmable, Multiplexed GPIO Pins With Input FilteringJTAG Boundary Scan Support(1)Advanced Emulation FeaturesAnalysis and Breakpoint FunctionsReal-Time Debug via HardwareDevelopment Support IncludesANSI C/C++ Compiler/Assembler/LinkerCode Composer Studio IDEDSP/BIOSDigital Motor Control and Digital Power Software LibrariesLow-Power Modes and Power SavingsIDLE, STANDBY, HALT Modes SupportedDisable Individual Peripheral ClocksPackage OptionsQuad Flatpack With Power-Pad (PTP)Thin Quad Flatpack (PGF, Preview Only)MicroStar BGA (GHH)Plastic BGA (GJZ)Temperature Options:A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)S: –40°C to 125°C (GJZ, Preview Only)Q: –40°C to 125°C (GJZ, Preview Only)M: –55°C to 125°C (PTP, GJZ)APPLICATIONSControlled BaselineOne Assembly/Test SiteOne Fabrication SiteAvailable in Military (–55°C/125°C) Temperature RangeExtended Product Life CycleExtended Product-Change NotificationProduct TraceabilitySUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONSControlled BaselineOne Assembly/Test SiteOne Fabrication SiteAvailable in Military (–55°C/125°C) Temperature Range(2)Extended Product Life CycleExtended Product-Change NotificationProduct Traceability(1)IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture(2)Additional temperature ranges are available - contact factoryHigh-Performance Static CMOS TechnologyUp to 150 MHz (6.67-ns Cycle Time)1.9-V/1.8-V Core, 3.3-V I/O DesignHigh-Performance 32-Bit CPUIEEE-754 Single-Precision Floating-Point Unit (FPU)16 x 16 and 32 x 32 MAC Operations16 x 16 Dual MACHarvard Bus ArchitectureFast Interrupt Response and ProcessingUnified Memory Programming ModelCode-Efficient (in C/C++ and Assembly)Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF)Over 2M x 16 Address ReachOn-Chip Memory256K x 16 Flash, 34K x 16 SARAM1K x 16 OTP ROMBoot ROM (8K x 16)With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)Standard Math TablesClock and System ControlDynamic PLL Ratio Changes SupportedOn-Chip OscillatorWatchdog Timer ModuleGPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core InterruptsPeripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts128-Bit Security Key/LockProtects Flash/OTP/RAM BlocksPrevents Firmware Reverse EngineeringEnhanced Control PeripheralsUp to 18 PWM OutputsUp to 6 HRPWM Outputs With 150 ps MEP ResolutionUp to 6 Event Capture InputsUp to 2 Quadrature Encoder InterfacesUp to 8 32-bit/Nine 16-bit TimersThree 32-Bit CPU TimersSerial Port PeripheralsUp to 2 CAN ModulesUp to 3 SCI (UART) ModulesUp to 2 McBSP Modules (Configurable as SPI)One SPI ModuleOne Inter-Integrated-Circuit (I2C) Bus12-Bit ADC, 16 Channels80-ns Conversion Rate2 x 8 Channel Input MultiplexerTwo Sample-and-HoldSingle/Simultaneous ConversionsInternal or External ReferenceUp to 88 Individually Programmable, Multiplexed GPIO Pins With Input FilteringJTAG Boundary Scan Support(1)Advanced Emulation FeaturesAnalysis and Breakpoint FunctionsReal-Time Debug via HardwareDevelopment Support IncludesANSI C/C++ Compiler/Assembler/LinkerCode Composer Studio IDEDSP/BIOSDigital Motor Control and Digital Power Software LibrariesLow-Power Modes and Power SavingsIDLE, STANDBY, HALT Modes SupportedDisable Individual Peripheral ClocksPackage OptionsQuad Flatpack With Power-Pad (PTP)Thin Quad Flatpack (PGF, Preview Only)MicroStar BGA (GHH)Plastic BGA (GJZ)Temperature Options:A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)S: –40°C to 125°C (GJZ, Preview Only)Q: –40°C to 125°C (GJZ, Preview Only)M: –55°C to 125°C (PTP, GJZ)APPLICATIONSControlled BaselineOne Assembly/Test SiteOne Fabrication SiteAvailable in Military (–55°C/125°C) Temperature RangeExtended Product Life CycleExtended Product-Change NotificationProduct TraceabilitySUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONSControlled BaselineOne Assembly/Test SiteOne Fabrication SiteAvailable in Military (–55°C/125°C) Temperature Range(2)Extended Product Life CycleExtended Product-Change NotificationProduct Traceability(1)IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture(2)Additional temperature ranges are available - contact factory
Description
AI
The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
Throughout this document, the device is abbreviated as F28335. provides a summary of features.
The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
Throughout this document, the device is abbreviated as F28335. provides a summary of features.