ADC12D1600 Series
12-bit, dual 1.6-GSPS or single 3.2-GSPS analog-to-digital converter (ADC)
Manufacturer: Texas Instruments
Catalog(4 parts)
Part | Mounting Type | Number of A/D Converters▲▼ | Package / Case | Sampling Rate (Per Second)▲▼ | Supplier Device Package | Operating Temperature▲▼ | Operating Temperature▲▼ | Number of Bits▲▼ | Ratio - S/H:ADC | Architecture | Configuration | Voltage - Supply, Digital▲▼ | Voltage - Supply, Digital▲▼ | Number of Inputs▲▼ | Data Interface | Input Type | Voltage - Supply, Analog▲▼ | Voltage - Supply, Analog▲▼ | Reference Type | Features |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Surface Mount | 2 ul | 292-BBGA | 3200000000 Ω | 292-BGA | -40 °C | 85 °C | 12 ul | |||||||||||||
Texas Instruments ADC12D1600CIUT12 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 292-BGA (27x27) | Surface Mount | 2 ul | 292-BBGA | 3200000000 Ω | 292-BGA | -40 °C | 85 °C | 12 ul | 1:1 | Folding Interpolating | MUX-S/H-ADC | 1.7999999523162842 V | 2 V | 2 ul | LVDS - Parallel | Differential | 1.7999999523162842 V | 2 V | Internal | Simultaneous Sampling |
Texas Instruments ADC12D1600RFIUT12 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 292-BGA (27x27) | Surface Mount | 2 ul | 292-BBGA | 3200000000 Ω | 292-BGA | -40 °C | 85 °C | 12 ul | 1:1 | Folding Interpolating | MUX-S/H-ADC | 1.7999999523162842 V | 2 V | 2 ul | LVDS - Parallel | Differential | 1.7999999523162842 V | 2 V | Internal | Simultaneous Sampling |
Texas Instruments ADC12D1600RFIUT/NOPB12 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 292-BGA (27x27) | Surface Mount | 2 ul | 292-BBGA | 3200000000 Ω | 292-BGA | -40 °C | 85 °C | 12 ul | 1:1 | Folding Interpolating | MUX-S/H-ADC | 1.7999999523162842 V | 2 V | 2 ul | LVDS - Parallel | Differential | 1.7999999523162842 V | 2 V | Internal | Simultaneous Sampling |
Key Features
• Configurable to Either 2.0/3.2 GSPS Interleavedor 1.0/1.6 GSPS Dual ADCPin-Compatible With ADC10D1x00 andADC12D1x00Internally Terminated, Buffered, DifferentialAnalog InputsInterleaved Timing Automatic and Manual SkewAdjustTest Patterns at Output for System DebugProgrammable 15-bit Gain and 12-bit Plus SignOffsetProgrammable tADAdjust Feature1:1 Non-demuxed or 1:2 Demuxed LVDS OutputsAutoSync Feature for Multi-Chip SystemsSingle 1.9-V ± 0.1-V Power SupplyConfigurable to Either 2.0/3.2 GSPS Interleavedor 1.0/1.6 GSPS Dual ADCPin-Compatible With ADC10D1x00 andADC12D1x00Internally Terminated, Buffered, DifferentialAnalog InputsInterleaved Timing Automatic and Manual SkewAdjustTest Patterns at Output for System DebugProgrammable 15-bit Gain and 12-bit Plus SignOffsetProgrammable tADAdjust Feature1:1 Non-demuxed or 1:2 Demuxed LVDS OutputsAutoSync Feature for Multi-Chip SystemsSingle 1.9-V ± 0.1-V Power Supply
Description
AI
The 12-bit, 2.0/3.2 GSPS ADC12D1x00 device is the latest advance in TI’s Ultra High-Speed ADC family and builds upon the features, architecture, and functionality of the 10-bit GHz family of ADCs.
The ADC12D1x00 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common-mode voltage.
The ADC12D1x00 is packaged in a leaded or lead-free 292-pin thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.
The 12-bit, 2.0/3.2 GSPS ADC12D1x00 device is the latest advance in TI’s Ultra High-Speed ADC family and builds upon the features, architecture, and functionality of the 10-bit GHz family of ADCs.
The ADC12D1x00 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common-mode voltage.
The ADC12D1x00 is packaged in a leaded or lead-free 292-pin thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.