APF19 Series

Catalog

HEATSINK FORGED W/ADHESIVE TAPE

Part	Material	Type	Fin Height [z]	Fin Height [z]	Width [y]	Width [y]	Package Cooled	Shelf Life	Length	Length	Shape	Thermal Resistance @ Forced Air Flow	Material Finish	Attachment Method	Fin Height [z]
CTS Thermal Management Products APF19-19-13CB/A01	Aluminum	Top Mount	12.7 mm	0.5 in	0.748 in	19 mm	ASIC, BGA, CPU, LGA	24 Months	0.748 in	19 mm	Fins, Square	4 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Included)
CTS Thermal Management Products APF19-19-10CB/A01	Aluminum	Top Mount	0.37 "		0.748 in	19 mm	ASIC, BGA, CPU, LGA	24 Months	0.748 in	19 mm	Fins, Square	5.3 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Included)	9.4 mm
CTS Thermal Management Products APF19-19-06CB/A01	Aluminum	Top Mount	6.35 mm	0.25 in	0.748 in	19 mm	ASIC, BGA, CPU, LGA	24 Months	0.748 in	19 mm	Fins, Square	7.1 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Included)
CTS Thermal Management Products APF19-19-10CB	Aluminum	Top Mount	0.37 "		0.748 in	19 mm	ASIC, BGA, CPU, LGA		0.748 in	19 mm	Fins, Square	5.3 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Not Included)	9.4 mm
CTS Thermal Management Products APF19-19-06CB	Aluminum	Top Mount	6.35 mm	0.25 in	0.748 in	19 mm	ASIC, BGA, CPU, LGA		0.748 in	19 mm	Fins, Square	7.1 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Not Included)
CTS Thermal Management Products APF19-19-13CB	Aluminum	Top Mount	12.7 mm	0.5 in	0.748 in	19 mm	ASIC, BGA, CPU, LGA		0.748 in	19 mm	Fins, Square	4 °C/W, 200 LFM	Black Anodized	Thermal Tape, Adhesive (Not Included)