
APF19-19-13CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
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APF19-19-13CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | APF19-19-13CB | 
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) | 
| Fin Height [z] | 12.7 mm | 
| Fin Height [z] | 0.5 in | 
| Length | 0.748 in | 
| Length | 19 mm | 
| Material | Aluminum | 
| Material Finish | Black Anodized | 
| Package Cooled | ASIC, BGA, LGA, CPU | 
| Shape | Square, Fins | 
| Thermal Resistance @ Forced Air Flow | 200 LFM, 4 °C/W | 
| Type | Top Mount | 
| Width [y] | 0.748 in | 
| Width [y] | 19 mm | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
APF19 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources