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APF19-19-06CB - APF19-19-06CB

APF19-19-06CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

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APF19-19-06CB - APF19-19-06CB

APF19-19-06CB

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK LOW-PROFILE FORGED

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAPF19-19-06CB
Attachment MethodThermal Tape, Adhesive (Not Included)
Fin Height [z]6.35 mm
Fin Height [z]0.25 in
Length0.748 in
Length19 mm
MaterialAluminum
Material FinishBlack Anodized
Package CooledASIC, BGA, LGA, CPU
ShapeSquare, Fins
Thermal Resistance @ Forced Air Flow7.1 °C/W, 200 LFM
TypeTop Mount
Width [y]0.748 in
Width [y]19 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

APF19 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents

Technical documentation and resources