CONN PLUG 50POS R/A SMD GOLD
| Part | Mounting Type | Contact Finish Thickness | Contact Finish Thickness | Contact Finish | Number of Rows | Features | Number of Positions | Height Above Board | Height Above Board | Pitch [x] | Pitch [x] | Height Above Board [z] | Mated Stacking Heights | Height Above Board [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAE Electronics | Surface Mount Right Angle | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 0.226 in | 5.74 mm | 0.8 mm | 0.031 in | |||
JAE Electronics | Surface Mount | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 4.75 mm | 0.8 mm | 0.031 in | 0.187 in | 5 mm 8 mm 11 mm 14 mm 17 mm | ||
JAE Electronics | Surface Mount | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 0.148 in | 3.75 mm | 0.8 mm | 0.031 in | 4 mm 7 mm 10 mm 13 mm 16 mm | ||
JAE Electronics | Surface Mount | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 0.226 in | 5.74 mm | 0.8 mm | 0.031 in | 6 mm 9 mm 12 mm 15 mm 18 mm | ||
JAE Electronics | Surface Mount Right Angle | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide | 50 | 0.226 in | 5.74 mm | 0.8 mm | 0.031 in | |||
JAE Electronics | Surface Mount | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 4.75 mm | 0.8 mm | 0.031 in | 0.187 in | 5 mm 8 mm 11 mm 14 mm 17 mm | ||
JAE Electronics | Surface Mount | 4 Áin | 0.1 Ám | Gold | 2 | Board Guide Solder Retention | 50 | 0.8 mm | 0.031 in | 0.384 in | 9.75 mm |