224-1275-29-0602J

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RECEPTACLE DIP SOCKET 24POS .6"

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224-1275-29-0602J

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RECEPTACLE DIP SOCKET 24POS .6"

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1	$ 34.69
		10	$ 26.80
		25	$ 24.29
		50	$ 22.60
		100	$ 21.06
		250	$ 19.26
		500	$ 18.04

Description

General part information

224 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	224-1275-29-0602J	224 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	15 - 25 mOhm
Convert From (Adapter End)	15.24 mm	15.24 mm
Convert From (Adapter End)	DIP	DIP
Convert From (Adapter End)	0.6 in	0.6 - 7.62 mm
Convert From (Adapter End)	-	0.3 in
Convert To (Adapter End)	0.6 in	0.3 - 0.6 in
Convert To (Adapter End)	DIP	DIP
Convert To (Adapter End)	15.24 mm	7.62 - 15.24 mm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Connector
Number of Pins	24	24
Number of Positions or Pins (Grid)	-	24
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.02 - 0.1 in
Pitch - Mating	2.54 mm	0.5 - 2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder, Press-Fit, Wire Wrap
Termination Post Length	3.3 mm	2.78 - 3.3 mm
Termination Post Length	0.13 in	0.11 - 0.13 in
Termination Post Length	-	0.62 in
Termination Post Length	-	15.75 mm
Type	-	QFN, DIP, ZIF (ZIP)
Type	-	7.62 mm
Type	-	0.3 in

224 Series

IC & COMPONENT SOCKET, 24 CONTACTS, DIP SOCKET, 2.54 MM, 224 SERIES, 7.62 MM, BERYLLIUM COPPER

Part	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Pitch - Post	Pitch - Post	Material Flammability Rating	Mounting Type	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Contact Material - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Housing Material	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Number of Pins	Termination Post Length	Termination Post Length	Type	Number of Positions or Pins (Grid)	Contact Resistance	Type	Type	Features	Termination Post Length [x]	Termination Post Length [x]	Convert From (Adapter End)
3M 224-5248-19-0602J	0.3 in	DIP	7.62 mm	2.54 mm	0.1 in	UL94 V-0	Through Hole	Gold	-55 °C	125 °C	DIP	0.3 in	7.62 mm	Beryllium Copper	1 A	30 Áin	0.76 Ám	0.1 in	2.54 mm	Beryllium Copper	Polysulfone (PSU), Glass Filled	Gold	30 µin	0.76 µm	Solder	24
3M 224-5205-01							Through Hole	Gold						Beryllium Copper				0.02 in	0.5 mm	Beryllium Copper	Polyethersulfone (PES)	Gold			Solder		0.118 in	3 mm	QFN	24	25 mOhm
3M 224-5248-00-0602J				2.54 mm	0.1 in	UL94 V-0	Connector	Gold	-55 °C	125 °C				Beryllium Copper	1 A	30 Áin	0.76 Ám	0.1 in	2.54 mm	Beryllium Copper	Polysulfone (PSU), Glass Filled	Gold	30 µin	0.76 µm	Press-Fit		0.11 in	2.78 mm	DIP, ZIF (ZIP)	24	15 mOhm	7.62 mm	0.3 in	Closed Frame
3M 224-1275-19-0602J	0.6 in	DIP	15.24 mm	2.54 mm	0.1 in	UL94 V-0	Through Hole	Gold	-55 °C	125 °C	DIP		0.6 in	Beryllium Copper	1 A	30 Áin	0.76 Ám	0.1 in	2.54 mm	Beryllium Copper	Polysulfone (PSU), Glass Filled	Gold	30 µin	0.76 µm	Wire Wrap	24								Closed Frame	0.62 in	15.75 mm	15.24 mm
3M 224-1275-29-0602J	0.6 in	DIP	15.24 mm	2.54 mm	0.1 in	UL94 V-0	Through Hole	Gold	-55 °C	125 °C	DIP		0.6 in	Beryllium Copper	1 A	30 Áin	0.76 Ám	0.1 in	2.54 mm	Beryllium Copper	Polysulfone (PSU), Glass Filled	Gold	30 µin	0.76 µm	Solder	24	0.13 in	3.3 mm						Closed Frame			15.24 mm