IC & COMPONENT SOCKET, 24 CONTACTS, DIP SOCKET, 2.54 MM, 224 SERIES, 7.62 MM, BERYLLIUM COPPER
| Part | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Pitch - Post | Pitch - Post | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Contact Material - Post | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Housing Material | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Number of Pins | Termination Post Length | Termination Post Length | Type | Number of Positions or Pins (Grid) | Contact Resistance | Type | Type | Features | Termination Post Length [x] | Termination Post Length [x] | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
0.3 in | DIP | 7.62 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.3 in | 7.62 mm | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Solder | 24 | ||||||||||||
Through Hole | Gold | Beryllium Copper | 0.02 in | 0.5 mm | Beryllium Copper | Polyethersulfone (PES) | Gold | Solder | 0.118 in | 3 mm | QFN | 24 | 25 mOhm | ||||||||||||||||||||||||
2.54 mm | 0.1 in | UL94 V-0 | Connector | Gold | -55 °C | 125 °C | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Press-Fit | 0.11 in | 2.78 mm | DIP, ZIF (ZIP) | 24 | 15 mOhm | 7.62 mm | 0.3 in | Closed Frame | |||||||||||
0.6 in | DIP | 15.24 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.6 in | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Wire Wrap | 24 | Closed Frame | 0.62 in | 15.75 mm | 15.24 mm | |||||||||
0.6 in | DIP | 15.24 mm | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | Gold | -55 °C | 125 °C | DIP | 0.6 in | Beryllium Copper | 1 A | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | 30 µin | 0.76 µm | Solder | 24 | 0.13 in | 3.3 mm | Closed Frame | 15.24 mm |