PLCC-044-T-N

Obsolete

Samtec Inc.

CONN SOCKET PLCC 44POS TIN

Search across all available documentation for this part.

Obsolete

Samtec Inc.

CONN SOCKET PLCC 44POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	PLCC-044-T-N

Contact Finish - Post	Tin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	10 mOhm
Features	Closed Frame
Housing Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	44
Number of Positions or Pins (Grid) [custom]	4, 11
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Type	PLCC

IC & Component Sockets 1.27mm SM Dip & Chip Socket

Part	Material Flammability Rating	Contact Resistance	Operating Temperature [Min]	Operating Temperature [Max]	Housing Material	Type	Contact Material - Mating	Contact Finish - Post	Termination	Pitch - Post	Pitch - Post	Contact Material - Post	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Features	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating
Samtec Inc. PLCC-044-T-N	UL94 V-0	10 mOhm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	PLCC	Beryllium Copper	Tin	Solder	2.54 mm	0.1 in	Beryllium Copper	Surface Mount	4 11	44	Closed Frame	0.05 in	1.27 mm
Samtec Inc. PLCC-044-F-N	UL94 V-0	10 mOhm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	PLCC	Beryllium Copper	Tin	Solder	2.54 mm	0.1 in	Beryllium Copper	Surface Mount	4 11	44	Closed Frame	0.05 in	1.27 mm	Gold	Flash

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

IC & Component Sockets 1.27mm SM Dip & Chip Socket

Technical documentation and resources