IDW30C65D1XKSA1

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Infineon Technologies

650 V, 30 A RAPID 1 EMITTER CONTROLLED POWER SILICON DIODE IN COMMON CATHODE CONFIGURATION IN A TO-247 PACKAGE

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DocumentsDatasheet Technical Data Sheet EN

IDW30C65D1XKSA1

Active

Infineon Technologies

650 V, 30 A RAPID 1 EMITTER CONTROLLED POWER SILICON DIODE IN COMMON CATHODE CONFIGURATION IN A TO-247 PACKAGE

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IDW30C65D1XKSA1

Current - Average Rectified (Io) (per Diode)	15 A
Current - Reverse Leakage @ Vr	40 µA
Diode Configuration	1 Pair Common Cathode
Mounting Type	Through Hole
Operating Temperature - Junction [Max]	175 ░C
Operating Temperature - Junction [Min]	-40 °C
Package / Case	TO-247-3
Reverse Recovery Time (trr)	71 ns
Speed	200 mA, 500 ns
Supplier Device Package	PG-TO247-3-1
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	650 V
Voltage - Forward (Vf) (Max) @ If	1.7 V

IDW30C65 Series

Part	Package / Case	Supplier Device Package	Operating Temperature - Junction [Min]	Operating Temperature - Junction [Max]	Reverse Recovery Time (trr)	Voltage - Forward (Vf) (Max) @ If	Current - Reverse Leakage @ Vr	Diode Configuration	Mounting Type	Speed	Voltage - DC Reverse (Vr) (Max) [Max]	Technology	Current - Average Rectified (Io) (per Diode)
Infineon Technologies IDW30C65D1XKSA1	TO-247-3	PG-TO247-3-1	-40 °C	175 ░C	71 ns	1.7 V	40 µA	1 Pair Common Cathode	Through Hole	200 mA 500 ns	650 V	Standard	15 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	240	$ 1.46
Newark	Each	1	$ 3.85
		10	$ 3.38
		100	$ 2.36
		720	$ 1.88
		1200	$ 1.80
		2640	$ 1.71

Description

General part information

IDW30C65 Series

Rapid 1switching 650 V, 30 A emitter controlledsilicon power diodein common cathode configuration and in a TO-247 package, allowing design optimization for more compact dimensions, easier assembly and consequently lower costs.