BSC070N10NS5SCATMA1
ActiveOPTIMOS™ 5 N-CHANNEL POWER MOSFET 100 V ; SUPERSO8 5X6 SUPER COOL PACKAGE; 7 MOHM;
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BSC070N10NS5SCATMA1
ActiveOPTIMOS™ 5 N-CHANNEL POWER MOSFET 100 V ; SUPERSO8 5X6 SUPER COOL PACKAGE; 7 MOHM;
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Technical Specifications
Parameters and characteristics for this part
| Specification | BSC070N10NS5SCATMA1 |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 82 A, 14 A |
| Drain to Source Voltage (Vdss) | 100 V |
| Drive Voltage (Max Rds On, Min Rds On) | 6 V, 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs [Max] | 38 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 2700 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 175 ░C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 8-PowerWDFN |
| Power Dissipation (Max) | 100 W, 3 W |
| Rds On (Max) @ Id, Vgs | 7 mOhm |
| Supplier Device Package | PG-WSON-8-2 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 3.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 3.39 | |
| 10 | $ 2.21 | |||
| 100 | $ 1.54 | |||
| 500 | $ 1.26 | |||
| 1000 | $ 1.16 | |||
| 2000 | $ 1.12 | |||
| Digi-Reel® | 1 | $ 3.39 | ||
| 10 | $ 2.21 | |||
| 100 | $ 1.54 | |||
| 500 | $ 1.26 | |||
| 1000 | $ 1.16 | |||
| 2000 | $ 1.12 | |||
| Tape & Reel (TR) | 4000 | $ 1.12 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 3.15 | |
| 10 | $ 2.05 | |||
| 25 | $ 1.84 | |||
| 50 | $ 1.63 | |||
| 100 | $ 1.42 | |||
| 250 | $ 1.29 | |||
| 500 | $ 1.15 | |||
| 1000 | $ 1.05 | |||
Description
General part information
BSC070 Series
OptiMOS™ 5 100 V power MOSFETsinSuperSO8 DSC (dual-side cooling)package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint. SuperSO8 DSC allows excellent thermal performance with two paths for heat dissipation (bottom through PCB + top through exposed clip and heatsink). About 30% of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB. Thus,
Documents
Technical documentation and resources