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SOIC (D)

TPA751D

Active
Texas Instruments

700-MW, MONO, ANALOG INPUT, CLASS-AB AUDIO AMPLIFIER IN BGA PACKAGING

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SOIC (D)

TPA751D

Active
Texas Instruments

700-MW, MONO, ANALOG INPUT, CLASS-AB AUDIO AMPLIFIER IN BGA PACKAGING

Find alt

Description

General part information

TPA751 Series

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

Technical Specifications

Parameters and characteristics for this part

SpecificationTPA751D
Channels1
FeaturesShort-Circuit and Thermal Protection, Shutdown, Differential Inputs
Load Impedance8 Ohm
Maximum Output Power (per Channel)700 mW
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Output Type1-Channel (Mono)
Package Length0.154 in
Package Name8-SOIC
Package Width3.9 mm
TypeClass AB
Voltage - Supply (Maximum)5.5 V
Voltage - Supply (Minimum)2.5 V

Pricing

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CAD

3D models and CAD resources for this part

    TPA751D | Texas Instruments | Zenode.ai