40-6556-31

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Aries Electronics

UNIV TEST SOCKET RECEPT 6556

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40-6556-31

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Aries Electronics

UNIV TEST SOCKET RECEPT 6556

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	40-6556-31

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature	150 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	10.74 mm
Termination Post Length	0.423 in
Type	DIP
Type	0.6 in
Type	15.24 mm

40-6556 Series

Part	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Housing Material	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Mounting Type	Termination	Operating Temperature
Aries Electronics 40-6556-40	Tin	0.18 in	4.57 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole
Aries Electronics 40-6556-30	Tin	0.423 in	10.74 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole	Wire Wrap
Aries Electronics 40-6556-10	Tin	0.13 in	3.3 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole	Solder
Aries Electronics 40-6556-31	Gold	0.423 in	10.74 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	10 çin	0.25 çm	Brass	Through Hole	Wire Wrap	150 °C
Aries Electronics 40-6556-11	Gold	0.13 in	3.3 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	10 çin	0.25 çm	Brass	Through Hole	Solder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	-	15	$ 27.75

Description

General part information

40-6556 Series

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available