40-6556 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Housing Material	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Mounting Type	Termination	Operating Temperature
Aries Electronics 40-6556-40	Tin	0.18 in	4.57 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole
Aries Electronics 40-6556-30	Tin	0.423 in	10.74 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole	Wire Wrap
Aries Electronics 40-6556-10	Tin	0.13 in	3.3 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	200 µin	5.08 µm	Brass	Through Hole	Solder
Aries Electronics 40-6556-31	Gold	0.423 in	10.74 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	10 çin	0.25 çm	Brass	Through Hole	Wire Wrap	150 °C
Aries Electronics 40-6556-11	Gold	0.13 in	3.3 mm	30 Áin	0.76 Ám	Beryllium Copper	Gold	3 A	2.54 mm	0.1 in	Open Frame	0.1 in	2.54 mm	40	20	2	DIP	0.6 in	15.24 mm	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	10 çin	0.25 çm	Brass	Through Hole	Solder