24-3573-10

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Aries Electronics

24P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

24P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	24-3573-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Material - Mating	Features	Housing Material	Termination	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Type	Type	Type	Contact Finish - Mating	Contact Material - Post	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 24-3573-11	Gold	0.11 in	2.78 mm	10 çin	0.25 çm	UL94 V-0	Beryllium Copper	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	24	0.1 in	2.54 mm	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	Gold	Beryllium Copper	Through Hole	10 çin	0.25 çm
Aries Electronics 24-3573-10	Tin	0.11 in	2.78 mm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	24	0.1 in	2.54 mm	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)		Beryllium Copper	Through Hole	200 µin	5.08 µm
Aries Electronics 24-3573-16	Nickel Boron	0.11 in	2.78 mm	50 µin	1.27 µm	UL94 V-0	Beryllium Nickel	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Solder	2.54 mm	0.1 in	24	0.1 in	2.54 mm	1 A	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	Beryllium Nickel	Through Hole	50 µin	1.27 µm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

24 (2 x 12) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Technical documentation and resources