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CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Material - Mating | Features | Housing Material | Termination | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Type | Type | Type | Contact Finish - Mating | Contact Material - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 0.11 in | 2.78 mm | 10 çin | 0.25 çm | UL94 V-0 | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | Beryllium Copper | Through Hole | 10 çin | 0.25 çm |
Aries Electronics | Tin | 0.11 in | 2.78 mm | 200 µin | 5.08 µm | UL94 V-0 | Beryllium Copper | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | Through Hole | 200 µin | 5.08 µm | |
Aries Electronics | Nickel Boron | 0.11 in | 2.78 mm | 50 µin | 1.27 µm | UL94 V-0 | Beryllium Nickel | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | 24 | 0.1 in | 2.54 mm | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | Beryllium Nickel | Through Hole | 50 µin | 1.27 µm |