628-25ABT3

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Wakefield-Vette

HEATSINK FOR 45MM BGA

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Wakefield-Vette

HEATSINK FOR 45MM BGA

Technical Specifications

Parameters and characteristics for this part

Specification	628-25ABT3

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height [z]	6.35 mm
Fin Height [z]	0.25 in
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	4.5 W, 80 °C
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	300 LFM, 7 °C/W
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Fin Height [z]	Fin Height [z]	Package Cooled	Material Finish	Power Dissipation @ Temperature Rise	Material	Thermal Resistance @ Forced Air Flow	Type	Attachment Method	Length	Length	Width [x]	Width [x]	Shape
Wakefield-Vette 628-25ABT5	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25AB	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Not Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25ABT3	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25ABT1E	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1000	$ 3.54

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.5W @ 80°C Top Mount

Technical documentation and resources