628-25 Series

Catalog

HEATSINK FOR 45MM BGA

Part	Fin Height [z]	Fin Height [z]	Package Cooled	Material Finish	Power Dissipation @ Temperature Rise	Material	Thermal Resistance @ Forced Air Flow	Type	Attachment Method	Length	Length	Width [x]	Width [x]	Shape
Wakefield-Vette 628-25ABT5	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25AB	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Not Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25ABT3	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square
Wakefield-Vette 628-25ABT1E	6.35 mm	0.25 in	ASIC BGA CPU LGA	Black Anodized	4.5 W 80 °C	Aluminum	7 °C/W 300 LFM	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	43.18 mm	1.7 in	Pin Fins Square