22-4518-10

Active

Aries Electronics

22P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Search across all available documentation for this part.

Active

Aries Electronics

22P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	22-4518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	22
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.4 in
Type	10.16 mm
Type	DIP

Part	Type	Type	Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Housing Material	Mounting Type	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Features	Pitch - Mating	Pitch - Mating	Termination
Aries Electronics 22-4518-11H	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Gold	10 çin	0.25 çm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder
Aries Electronics 22-4518-10	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Tin	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder
Aries Electronics 22-4518-10M	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Tin	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

22 (2 x 11) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources