22-4518 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Type	Type	Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Housing Material	Mounting Type	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Features	Pitch - Mating	Pitch - Mating	Termination
Aries Electronics 22-4518-11H	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Gold	10 çin	0.25 çm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder
Aries Electronics 22-4518-10	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Tin	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder
Aries Electronics 22-4518-10M	0.4 in	10.16 mm	DIP	22	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Brass	Beryllium Copper	10 çin	0.25 çm	3.18 mm	0.125 in	Tin	200 µin	5.08 µm	UL94 V-0	3 A	Gold	Open Frame	0.1 in	2.54 mm	Solder