Specification	BBL-110-T-E

Connector Type	Header
Contact Finish - Mating	Tin
Contact Finish - Post	Nickel
Contact Finish Thickness - Post	50 µin
Contact Length - Mating	0.105 in
Contact Length - Post	0.125 in
Contact Shape	Circular
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.07 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	10
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.3 in
Pitch - Mating	0.1 in
Shrouding	Unshrouded
Style	Board
Termination	Solder

BBL Series

Part	Insulation Height	Contact Length - Mating	Contact Type	Connector Type	Insulation Material	Contact Finish - Post	Overall Contact Length	Mounting Type	Number of Positions	Style	Contact Length - Post	Number of Positions Loaded	Shrouding	Contact Shape	Pitch - Mating	Insulation Color	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Fastening Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Mating
Samtec Inc. BBL-102-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	2	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-116-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	16	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-123-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	23	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-123-G-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	23	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Gold	Push-Pull	Solder		20 Ąin
Samtec Inc. BBL-126-T-F	0.085 in	0.122 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.332 in	Through Hole	26	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-127-G-F	0.085 in	0.122 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.332 in	Through Hole	27	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Gold	Push-Pull	Solder		20 Ąin
Samtec Inc. BBL-106-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	6	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-114-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	14	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-110-T-E	0.07 in	0.105 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.3 in	Through Hole	10	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin
Samtec Inc. BBL-130-T-F	0.085 in	0.122 in	Male Pin	Header	Liquid Crystal Polymer (LCP)	Nickel	0.332 in	Through Hole	30	Board	0.125 in	All	Unshrouded	Circular	0.1 in	Black	1	125 °C	-55 °C	Tin	Push-Pull	Solder	50 µin