
RFN20TJ6SFHGC9
ActiveRohm Semiconductor
SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

RFN20TJ6SFHGC9
ActiveRohm Semiconductor
SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)
Description
General part information
RFN20 Series
ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN20TJ6SFHGC9 |
|---|---|
| Current - Average Rectified (Io) | 20 A |
| Current - Reverse Leakage | 10 µA |
| Grade | Automotive |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-2 Full Pack |
| Package Name | TO-220ACFP |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 140 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.55 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
PCB Layout Thermal Design Guide
What is a Thermal Model? (Diode)
Taping Information
How to Select Reverse Current Protection Diodes for LDO Regulators
About Flammability of Materials
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
List of Diode Package Thermal Resistance
What Is Thermal Design
Judgment Criteria of Thermal Evaluation
Diode Types and Applications
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
About Export Regulations
How to Select Rectifier Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
Part Explanation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Thermocouples
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models
Measurement Method and Usage of Thermal Resistance RthJC
Compliance of the RoHS directive
Inner Structure
Method for Monitoring Switching Waveform
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Package Dimensions
Reliability Test Result
Absolute Maximum Rating and Electrical Characteristics of Diodes
RFN20TJ6SFHG ESD Data
Condition of Soldering / Land Pattern Reference
Notes for Calculating Power Consumption:Static Operation
Power Loss and Thermal Design of Diodes
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Impedance Characteristics of Bypass Capacitor
Certificate of not containing SVHC under REACH Regulation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Moisture Sensitivity Level - Diodes
Anti-Whisker formation - Diodes
Basics of Thermal Resistance and Heat Dissipation
How to Use LTspice® Models: Tips for Improving Convergence