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353_TO220AC__2

RFN20TF6SC9

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Rohm Semiconductor

DIODE GEN PURP 600V 20A TO220NFM

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353_TO220AC__2

RFN20TF6SC9

Active
Rohm Semiconductor

DIODE GEN PURP 600V 20A TO220NFM

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Description

General part information

RFN20 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN20TF6SC9
Current - Average Rectified (Io)20 A
Current - Reverse Leakage10 µA
Mounting TypeThrough Hole
Operating Temperature - Junction150 °C
Package / CaseTO-220-2 Full Pack
Package NameTO-220NFM
Reverse Recovery Time (trr)60 ns
Speed - Fast Recovery (Maximum)500 ns
Speed - Fast Recovery (Minimum)200 mA
TechnologyStandard
Voltage - DC Reverse (Vr) (Max)600 V
Voltage - Forward (Vf) (Max)1.55 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Two-Resistor Model for Thermal Simulation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Condition of Soldering / Land Pattern Reference
How to Create Symbols for PSpice Models
Reliability Test Result
Notes for Calculating Power Consumption:Static Operation
RFN20TF6S Reference Circuit
About Export Regulations
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Use LTspice® Models
Notes for Temperature Measurement Using Thermocouples
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Explanation for Marking
Diode Types and Applications
How to Select Rectifier Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Measurement Method and Usage of Thermal Resistance RthJC
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Certificate of not containing SVHC under REACH Regulation
ESD Data
How to Select Reverse Current Protection Diodes for LDO Regulators
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Absolute Maximum Rating and Electrical Characteristics of Diodes
List of Diode Package Thermal Resistance
Compliance of the RoHS directive
Anti-Whisker formation - Diodes
Power Loss and Thermal Design of Diodes
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Judgment Criteria of Thermal Evaluation
Basics of Thermal Resistance and Heat Dissipation
Package Dimensions
Method for Monitoring Switching Waveform
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Inner Structure
What Is Thermal Design
Taping Information
Part Explanation
Moisture Sensitivity Level - Diodes
How to Use LTspice&reg; Models: Tips for Improving Convergence
Importance of Probe Calibration When Measuring Power: Deskew
PCB Layout Thermal Design Guide
About Flammability of Materials
Impedance Characteristics of Bypass Capacitor
What is a Thermal Model? (Diode)