19-0503-30

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Aries Electronics

19P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

19P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	19-0503-30

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Housing Material	Polyamide (PA), Nylon, Glass Filled
Material Flammability Rating	UL94 HB
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	1 x 19
Number of Positions or Pins (Grid) [custom]	19
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.5 in
Termination Post Length	12.7 mm
Type	SIP

Part	Housing Material	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Mounting Type	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Material - Mating	Termination	Type	Termination Post Length	Termination Post Length	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 19-0503-31	Polyamide (PA) Nylon Glass Filled	Brass	30 Áin	0.76 Ám	Gold	1 x 19	19	Through Hole	UL94 HB	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	2.54 mm	0.1 in	3 A	Beryllium Copper	Wire Wrap	SIP	0.5 in	12.7 mm
Aries Electronics 19-0503-21	Polyamide (PA) Nylon Glass Filled	Brass	30 Áin	0.76 Ám	Gold	1 x 19	19	Through Hole	UL94 HB	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	2.54 mm	0.1 in	3 A	Beryllium Copper	Wire Wrap	SIP			0.36 in	9.14 mm
Aries Electronics 19-0503-30	Polyamide (PA) Nylon Glass Filled	Brass	30 Áin	0.76 Ám	Gold	1 x 19	19	Through Hole	UL94 HB	0.1 in	2.54 mm	Tin	200 µin	5.08 µm	2.54 mm	0.1 in	3 A	Beryllium Copper	Wire Wrap	SIP	0.5 in	12.7 mm
Aries Electronics 19-0503-20	Polyamide (PA) Nylon Glass Filled	Brass	30 Áin	0.76 Ám	Gold	1 x 19	19	Through Hole	UL94 HB	0.1 in	2.54 mm	Tin	200 µin	5.08 µm	2.54 mm	0.1 in	3 A	Beryllium Copper	Wire Wrap	SIP			0.36 in	9.14 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

19 (1 x 19) Pos SIP Socket Gold Through Hole

Technical documentation and resources