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19-0503-31

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Aries Electronics

CONN SOCKET SIP 19POS GOLD

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19-0503-31

Active
Aries Electronics

CONN SOCKET SIP 19POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification19-0503-31
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
Housing MaterialPolyamide (PA), Nylon, Glass Filled
Material Flammability RatingUL94 HB
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]1 x 19
Number of Positions or Pins (Grid) [custom]19
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length0.5 in
Termination Post Length12.7 mm
TypeSIP

19-0503 Series

PartHousing MaterialContact Material - Post [custom]Contact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish - MatingNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Mounting TypeMaterial Flammability RatingPitch - MatingPitch - MatingContact Finish - PostContact Finish Thickness - PostContact Finish Thickness - PostPitch - PostPitch - PostCurrent Rating (Amps)Contact Material - MatingTerminationTypeTermination Post LengthTermination Post LengthTermination Post Length [x]Termination Post Length [x]
Aries Electronics
Polyamide (PA)
Nylon
Glass Filled
Brass
30 Áin
0.76 Ám
Gold
1 x 19
19
Through Hole
UL94 HB
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
2.54 mm
0.1 in
3 A
Beryllium Copper
Wire Wrap
SIP
0.5 in
12.7 mm
Aries Electronics
Polyamide (PA)
Nylon
Glass Filled
Brass
30 Áin
0.76 Ám
Gold
1 x 19
19
Through Hole
UL94 HB
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
2.54 mm
0.1 in
3 A
Beryllium Copper
Wire Wrap
SIP
0.36 in
9.14 mm
Aries Electronics
Polyamide (PA)
Nylon
Glass Filled
Brass
30 Áin
0.76 Ám
Gold
1 x 19
19
Through Hole
UL94 HB
0.1 in
2.54 mm
Tin
200 µin
5.08 µm
2.54 mm
0.1 in
3 A
Beryllium Copper
Wire Wrap
SIP
0.5 in
12.7 mm
Aries Electronics
Polyamide (PA)
Nylon
Glass Filled
Brass
30 Áin
0.76 Ám
Gold
1 x 19
19
Through Hole
UL94 HB
0.1 in
2.54 mm
Tin
200 µin
5.08 µm
2.54 mm
0.1 in
3 A
Beryllium Copper
Wire Wrap
SIP
0.36 in
9.14 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 34$ 13.99

Description

General part information

19-0503 Series

19 (1 x 19) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources