IRG4CC50WB

Obsolete

Infineon Technologies

IGBT CHIP

Search across all available documentation for this part.

Obsolete

Infineon Technologies

IGBT CHIP

Technical Specifications

Parameters and characteristics for this part

Specification	IRG4CC50WB

Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die
Vce(on) (Max) @ Vge, Ic	2.3 V
Voltage - Collector Emitter Breakdown (Max) [Max]	600 V

Part	Mounting Type	Supplier Device Package	Package / Case	Vce(on) (Max) @ Vge, Ic	Voltage - Collector Emitter Breakdown (Max) [Max]	Current - Collector (Ic) (Max) [Max]	Reverse Recovery Time (trr)
Infineon Technologies IRG4CC40KB	Surface Mount	Die	Die	2.4 V	600 V
Infineon Technologies IRG4CC50WC	Surface Mount	Die	Die		600 V	27 A	33 ns
Infineon Technologies IRG4CC30FB	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC40FB	Surface Mount	Die	Die	1.6 V	600 V
Infineon Technologies IRG4CC50WB	Surface Mount	Die	Die	2.3 V	600 V
Infineon Technologies IRG4CC80SB	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC80UD	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC50UB	Through Hole	Die	Die	2 V	600 V	55 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

IGBT 600 V Surface Mount Die

Technical documentation and resources

No documents available