IRG4CC50WC

Obsolete

Infineon Technologies

IGBT CHIP

Search across all available documentation for this part.

Obsolete

Infineon Technologies

IGBT CHIP

Technical Specifications

Parameters and characteristics for this part

Specification	IRG4CC50WC

Current - Collector (Ic) (Max) [Max]	27 A
Mounting Type	Surface Mount
Package / Case	Die
Reverse Recovery Time (trr)	33 ns
Supplier Device Package	Die
Voltage - Collector Emitter Breakdown (Max) [Max]	600 V

Part	Mounting Type	Supplier Device Package	Package / Case	Vce(on) (Max) @ Vge, Ic	Voltage - Collector Emitter Breakdown (Max) [Max]	Current - Collector (Ic) (Max) [Max]	Reverse Recovery Time (trr)
Infineon Technologies IRG4CC40KB	Surface Mount	Die	Die	2.4 V	600 V
Infineon Technologies IRG4CC50WC	Surface Mount	Die	Die		600 V	27 A	33 ns
Infineon Technologies IRG4CC30FB	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC40FB	Surface Mount	Die	Die	1.6 V	600 V
Infineon Technologies IRG4CC50WB	Surface Mount	Die	Die	2.3 V	600 V
Infineon Technologies IRG4CC80SB	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC80UD	Surface Mount	Die	Die		600 V
Infineon Technologies IRG4CC50UB	Through Hole	Die	Die	2 V	600 V	55 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

IGBT 600 V 27 A Surface Mount Die

Technical documentation and resources

No documents available