81-01-14618-2000

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics commom to parts in this series

RFI FINGERSTOCK BECU UNPLAT ADH

Part	Plating	Type	Operating Temperature [Min]	Operating Temperature [Max]	Material	Width [x]	Width [x]	Length	Length	Attachment Method	Height [z]	Height [z]	Width	Length [x]	Length [x]	Width
Parker Chomerics 81-01-14309-2000	Unplated	Fingerstock	-40 °C	121 °C	Beryllium Copper	0.561 in	14.24 mm	15.748 in	400 mm	Non-Conductive Adhesive	5.59 mm	0.22 in
Parker Chomerics 81-01-14618-2000	Unplated	Fingerstock	-40 °C	121 °C	Beryllium Copper	0.3 "				Non-Conductive Adhesive	2.54 mm	0.1 in	7.62 mm	15.984 "	406 mm
Parker Chomerics 81-01-32AS1-2000	Unplated	Fingerstock	-40 °C	121 °C	Beryllium Copper					Non-Conductive Adhesive	5.59 mm	0.22 in	15.24 mm	17.992 in	457 mm	0.6 in
Parker Chomerics 81-01-14215-2000	Unplated	Fingerstock	-40 °C	121 °C	Beryllium Copper	0.37 in				Non-Conductive Adhesive	3.3 mm	0.13 in	9.4 mm	17.992 in	457 mm

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