RFI FINGERSTOCK BECU UNPLAT ADH
| Part | Plating | Type | Operating Temperature [Min] | Operating Temperature [Max] | Material | Width [x] | Width [x] | Length | Length | Attachment Method | Height [z] | Height [z] | Width | Length [x] | Length [x] | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Parker Chomerics 81-01-14309-2000 | Unplated | Fingerstock | -40 °C | 121 °C | Beryllium Copper | 0.561 in | 14.24 mm | 15.748 in | 400 mm | Non-Conductive Adhesive | 5.59 mm | 0.22 in | ||||
Parker Chomerics 81-01-14618-2000 | Unplated | Fingerstock | -40 °C | 121 °C | Beryllium Copper | 0.3 " | Non-Conductive Adhesive | 2.54 mm | 0.1 in | 7.62 mm | 15.984 " | 406 mm | ||||
Parker Chomerics 81-01-32AS1-2000 | Unplated | Fingerstock | -40 °C | 121 °C | Beryllium Copper | Non-Conductive Adhesive | 5.59 mm | 0.22 in | 15.24 mm | 17.992 in | 457 mm | 0.6 in | ||||
Parker Chomerics 81-01-14215-2000 | Unplated | Fingerstock | -40 °C | 121 °C | Beryllium Copper | 0.37 in | Non-Conductive Adhesive | 3.3 mm | 0.13 in | 9.4 mm | 17.992 in | 457 mm |