25-0518-10

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Aries Electronics

25P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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25-0518-10

Active

Aries Electronics

25P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	25-0518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	25
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	SIP

25-0518 Series

Part	Contact Material - Mating	Mounting Type	Contact Finish - Mating	Material Flammability Rating	Contact Finish - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Type	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination
Aries Electronics 25-0518-10H	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-10T	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-11H	Beryllium Copper	Through Hole	Gold	UL94 V-0	Gold	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-11	Beryllium Copper	Through Hole	Gold	UL94 V-0	Gold	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-10	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	216	$ 2.34
LCSC	Piece	1	$ 4.71
		204	$ 1.88
		493	$ 1.82
		1003	$ 1.79

Description

General part information

25-0518 Series

25 (1 x 25) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources