25-0518 Series

Catalog

CONN SOCKET SIP 25POS GOLD

Part	Contact Material - Mating	Mounting Type	Contact Finish - Mating	Material Flammability Rating	Contact Finish - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Type	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination
Aries Electronics 25-0518-10H	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-10T	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-11H	Beryllium Copper	Through Hole	Gold	UL94 V-0	Gold	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-11	Beryllium Copper	Through Hole	Gold	UL94 V-0	Gold	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder
Aries Electronics 25-0518-10	Beryllium Copper	Through Hole	Gold	UL94 V-0	Tin	Open Frame	10 çin	0.25 çm	3.18 mm	0.125 in	Brass	0.1 in	2.54 mm	25	2.54 mm	0.1 in	SIP	3 A	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder