HPF-20-02-H-S-04
ActiveSamtec Inc.
.200 HI POWER SOCKET ASSEMBLY
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HPF-20-02-H-S-04
ActiveSamtec Inc.
.200 HI POWER SOCKET ASSEMBLY
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HPF-20-02-H-S-04 |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material | Beryllium Copper |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 8.92 mm |
| Insulation Height | 0.351 in |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Surface Mount |
| Number of Positions | 20 |
| Number of Positions Loaded | 19 |
| Number of Rows | 1 |
| Pitch - Mating | 5.08 mm |
| Pitch - Mating | 0.2 in |
| Termination | Solder |
HPF-20 Series
| Part | Number of Positions | Termination | Contact Type | Fastening Type | Insulation Color | Contact Length - Post | Contact Length - Post | Insulation Material | Mounting Type | Number of Positions Loaded | Contact Material | Contact Shape | Number of Rows | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Insulation Height | Insulation Height | Connector Type | Number of Positions Loaded | Features | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | 0.102 in | 2.6 mm | Liquid Crystal Polymer (LCP) | Through Hole | All | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Tin | 8.92 mm | 0.351 in | Receptacle | |||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | 0.102 in | 2.6 mm | Liquid Crystal Polymer (LCP) | Through Hole | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Tin | 8.92 mm | 0.351 in | Receptacle | 19 | |||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | Liquid Crystal Polymer (LCP) | Surface Mount | All | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Tin | 8.92 mm | 0.351 in | Receptacle | Pick and Place | ||||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | 0.102 in | 2.6 mm | Liquid Crystal Polymer (LCP) | Through Hole | All | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Gold | 8.92 mm | 0.351 in | Receptacle | Gold | ||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | Liquid Crystal Polymer (LCP) | Surface Mount | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Gold | 8.92 mm | 0.351 in | Receptacle | 19 | Gold | ||||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | 0.102 in | 2.6 mm | Liquid Crystal Polymer (LCP) | Through Hole | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Tin | 8.92 mm | 0.351 in | Receptacle | 19 | |||
Samtec Inc. | 20 | Solder | Female Socket | Push-Pull | Black | 0.102 in | 2.6 mm | Liquid Crystal Polymer (LCP) | Through Hole | Beryllium Copper | Square | 1 | 5.08 mm | 0.2 in | Tin | 8.92 mm | 0.351 in | Receptacle | 19 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 5 | $ 43.57 | |
Description
General part information
HPF-20 Series
20 Position Receptacle Connector 0.200" (5.08mm) Surface Mount Gold
Documents
Technical documentation and resources
No documents available