HPF-20 Series

Catalog

.200 HI POWER SOCKET ASSEMBLY

Part	Number of Positions	Termination	Contact Type	Fastening Type	Insulation Color	Contact Length - Post	Contact Length - Post	Insulation Material	Mounting Type	Number of Positions Loaded	Contact Material	Contact Shape	Number of Rows	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Insulation Height	Insulation Height	Connector Type	Number of Positions Loaded	Features	Contact Finish - Mating
Samtec Inc. HPF-20-01-TM-S	20	Solder	Female Socket	Push-Pull	Black	0.102 in	2.6 mm	Liquid Crystal Polymer (LCP)	Through Hole	All	Beryllium Copper	Square	1	5.08 mm	0.2 in	Tin	8.92 mm	0.351 in	Receptacle
Samtec Inc. HPF-20-01-T-S-04	20	Solder	Female Socket	Push-Pull	Black	0.102 in	2.6 mm	Liquid Crystal Polymer (LCP)	Through Hole		Beryllium Copper	Square	1	5.08 mm	0.2 in	Tin	8.92 mm	0.351 in	Receptacle	19
Samtec Inc. HPF-20-02-T-S-K	20	Solder	Female Socket	Push-Pull	Black			Liquid Crystal Polymer (LCP)	Surface Mount	All	Beryllium Copper	Square	1	5.08 mm	0.2 in	Tin	8.92 mm	0.351 in	Receptacle		Pick and Place
Samtec Inc. HPF-20-01-H-S	20	Solder	Female Socket	Push-Pull	Black	0.102 in	2.6 mm	Liquid Crystal Polymer (LCP)	Through Hole	All	Beryllium Copper	Square	1	5.08 mm	0.2 in	Gold	8.92 mm	0.351 in	Receptacle			Gold
Samtec Inc. HPF-20-02-H-S-04	20	Solder	Female Socket	Push-Pull	Black			Liquid Crystal Polymer (LCP)	Surface Mount		Beryllium Copper	Square	1	5.08 mm	0.2 in	Gold	8.92 mm	0.351 in	Receptacle	19		Gold
Samtec Inc. HPF-20-01-T-S-03	20	Solder	Female Socket	Push-Pull	Black	0.102 in	2.6 mm	Liquid Crystal Polymer (LCP)	Through Hole		Beryllium Copper	Square	1	5.08 mm	0.2 in	Tin	8.92 mm	0.351 in	Receptacle	19
Samtec Inc. HPF-20-01-T-S-08	20	Solder	Female Socket	Push-Pull	Black	0.102 in	2.6 mm	Liquid Crystal Polymer (LCP)	Through Hole		Beryllium Copper	Square	1	5.08 mm	0.2 in	Tin	8.92 mm	0.351 in	Receptacle	19