614-83-428-31-012101

Active

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

614-83-428-31-012101

Active

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

Description Specifications Series Pricing CAD Documents

Description

General part information

614-83 Series

28 (2 x 14) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	614-83-428-31-012101

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	29.5 Ąin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Open Frame, Carrier
Grid Columns	14
Grid Rows	2
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.4 in
Termination	Solder
Termination Post Length	0.136 in
Type	DIP, 0.4" (10.16mm) Row Spacing

614-83 Series

Part	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Post	Mounting Type	Contact Material - Post	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Post	Housing Material	Termination	Contact Material - Mating	Features	Contact Finish Thickness - Mating	Row Spacing	Type	Contact Finish - Mating	Termination Post Length	Current Rating	Contact Resistance	Material Flammability Rating
Preci-Dip 614-83-950-41-001101	25	2	50	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin	0.9 in	0.9" (22.86mm) Row Spacing DIP	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-428-31-012101	14	2	28	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin	0.4 in	0.4" (10.16mm) Row Spacing DIP	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-044-08-031112	8	8	44	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin		PGA	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-069-11-061112	11	11	69	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin		PGA	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-068-10-061112	10	10	68	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin		PGA	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-636-31-012101	18	2	36	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-304-41-001101	2	2	4	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-952-31-012101	26	2	52	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin	0.9 in	0.9" (22.86mm) Row Spacing DIP	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-179-18-112112	18	18	179	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin		PGA	Gold	0.136 in	1 A	10 mOhm	UL94 V-0
Preci-Dip 614-83-084-10-001112	10	10	84	0.1 in	Tin	Through Hole	Brass	125 °C	-55 °C	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Solder	Beryllium Copper	Carrier Open Frame	29.5 Ąin		PGA	Gold	0.136 in	1 A	10 mOhm	UL94 V-0

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

614-83-428-31-012101 | Datasheet