614-83 Series
Manufacturer: Preci-Dip
Beta
⌘K
CONN IC DIP SOCKET 50POS GOLD
| Part | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Post | Mounting Type | Contact Material - Post | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Post | Housing Material | Termination | Contact Material - Mating | Features | Contact Finish Thickness - Mating | Row Spacing | Type | Contact Finish - Mating | Termination Post Length | Current Rating | Contact Resistance | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Preci-Dip | 25 | 2 | 50 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |
Preci-Dip | 14 | 2 | 28 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | 0.4 in | 0.4" (10.16mm) Row Spacing DIP | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |
Preci-Dip | 8 | 8 | 44 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | PGA | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 | |
Preci-Dip | 11 | 11 | 69 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | PGA | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 | |
Preci-Dip | 10 | 10 | 68 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | PGA | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 | |
Preci-Dip | 18 | 2 | 36 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |
Preci-Dip | 2 | 2 | 4 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |
Preci-Dip | 26 | 2 | 52 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |
Preci-Dip | 18 | 18 | 179 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | PGA | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 | |
Preci-Dip | 10 | 10 | 84 | 0.1 in | Tin | Through Hole | Brass | 125 °C | -55 °C | 0.1 in | Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester | Solder | Beryllium Copper | Carrier Open Frame | 29.5 Ąin | PGA | Gold | 0.136 in | 1 A | 10 mOhm | UL94 V-0 |