44-3552-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 44POS GLD
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
44-3552-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 44POS GLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 44-3552-11 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 44 Positions or Pins |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
44-3552 Series
| Part | Type | Type | Type | Current Rating (Amps) | Contact Material - Post | Housing Material | Features | Termination | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Mounting Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | Solder | UL94 V-0 | 44 Positions or Pins | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | Through Hole | Nickel Boron | 0.1 in | 2.54 mm | Nickel Boron | Beryllium Copper | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | ||
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | Solder | UL94 V-0 | 44 Positions or Pins | 5.08 µm | 200 µin | 0.11 in | 2.78 mm | Through Hole | Tin | 0.1 in | 2.54 mm | Beryllium Copper | 2.54 mm | 0.1 in | 5.08 µm | 200 µin | |||
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Nickel | Polyetheretherketone (PEEK) Glass Filled | Closed Frame | Solder | UL94 V-0 | 44 Positions or Pins | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | Through Hole | Nickel Boron | 0.1 in | 2.54 mm | Nickel Boron | Beryllium Nickel | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | -55 °C | 250 °C |
Aries Electronics | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | Solder | UL94 V-0 | 44 Positions or Pins | 0.11 in | 2.78 mm | Through Hole | Gold | 0.1 in | 2.54 mm | Gold | Beryllium Copper | 2.54 mm | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 21 | $ 27.26 | |
Description
General part information
44-3552 Series
44 (2 x 22) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources