44-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Material Flammability Rating	Termination Post Length	Current Rating	Pitch - Post	Termination	Row Spacing	Type	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Features	Contact Finish - Mating	Housing Material	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 44-3552-16	UL94 V-0	0.11 in	1 A	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	44	2	22	Closed Frame	Boron Nickel	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Nickel Boron	50 µin	50 µin	Beryllium Copper	0.1 in	Through Hole
Aries Electronics 44-3552-10	UL94 V-0	0.11 in	1 A	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	44	2	22	Closed Frame	Tin	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Tin	200 µin	200 Ąin	Beryllium Copper	0.1 in	Through Hole
Aries Electronics 44-3552-18	UL94 V-0	0.11 in	1 A	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	44	2	22	Closed Frame	Boron Nickel	Glass Filled PEEK Polyetheretherketone	Beryllium Nickel	Nickel Boron	50 µin	50 µin	Beryllium Nickel	0.1 in	Through Hole	250 °C	-55 °C
Aries Electronics 44-3552-11	UL94 V-0	0.11 in	1 A	0.1 in	Solder	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	44	2	22	Closed Frame	Gold	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Gold			Beryllium Copper	0.1 in	Through Hole