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MSP430FR6927IPM

MSP430FR6927IPM

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR6927IPM

MSP430FR6927IPM

Active
Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR6927 Series

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR6927IPM
A/D Channels8 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O52
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case64-LQFP
Package Length10 mm
Package Name64-LQFP
Package Width10 mm
PeripheralsLCD, DMA, PWM, POR, Reset, WDT, Brown-out Detect
Program Memory Depth64 K
Program Memory Size64 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430FR58,59,68,69xx User Guide
ESD Diode Current Specification (Rev. B)
MSP430FR6927 Microcontroller Errata (Rev. AA)
MSP430 System ESD Troubleshooting Guide
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs
Benchmarking MCU power consumption for ultra-low-power applications
MSP430 MCUs Development Guide Book (Rev. A)
LC Sensor Rotation Detection With MSP430 Extended Scan Interface (ESI)
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
MSP Code Protection Features
MSP430 FRAM Quality and Reliability (Rev. A)
Secure In-Field Firmware Updates for MSP MCUs
FRAM FAQs
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Migrating From MSP430FW42x Scan Interface to MSP430FR6x8x/FR5x8x ESI (Rev. A)
Adjustment of ESIOSC Oscillator Frequency (Rev. A)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
MSP430 System-Level ESD Considerations (Rev. B)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
Enabling secure portable medical devices with TI’s MSP430™ MCU
Capacitive Touch and MSP Microcontrollers (Rev. A)
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)
MSP430FR697x(1), MSP430FR692x(1) Mixed-Signal Microcontrollers datasheet (Rev. C)
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
Designing With MSP430™ MCUs and Segment LCDs (Rev. A)