Technical Specifications
Parameters and characteristics for this part
| Specification | YTQ-112-01-S-Q |
|---|---|
| Connector Type | Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 1.27 µm |
| Contact Finish Thickness - Post | 50 µin |
| Contact Length - Post | 0.09 " |
| Contact Length - Post | 2.29 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 6.35 mm |
| Insulation Height | 0.25 in |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Through Hole |
| Number of Positions | 48 |
| Number of Positions Loaded | All |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Termination | Solder |
YTQ Series
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Square Tail Socket Strip\/
| Part | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height | Insulation Height | Contact Type | Contact Finish - Mating | Pitch - Mating [x] | Pitch - Mating [x] | Number of Rows | Connector Type | Number of Positions | Contact Finish - Post | Fastening Type | Row Spacing - Mating | Row Spacing - Mating | Contact Shape | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Insulation Material | Insulation Color | Mounting Type | Contact Material | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 5.28 mm | 0.208 in | 30 Áin | 0.76 Ám | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | 6 | Socket | 288 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All |
Samtec Inc. | 2.29 mm | 0.09 " | 3 µin | 0.076 µm | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | 5 | Socket | 50 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All |
Samtec Inc. | 2.29 mm | 0.09 " | 30 Áin | 0.76 Ám | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | Socket | 48 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All | |
Samtec Inc. | 2.29 mm | 0.09 " | 10 çin | 0.25 çm | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | 6 | Socket | 252 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All |
Samtec Inc. | 2.29 mm | 0.09 " | 10 çin | 0.25 çm | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | Socket | 44 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All | |
Samtec Inc. | 15.24 mm | 0.6 in | 10 çin | 0.25 çm | 1.27 µm | 50 µin | 6.35 mm | 0.25 in | Forked | Gold | 0.079 in | 2 mm | Socket | 120 | Tin | Push-Pull | 0.079 in | 2 mm | Square | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Black | Through Hole | Phosphor Bronze | All |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
YTQ Series
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Square Tail Socket Strip\/
Documents
Technical documentation and resources
