YTQ Series
Manufacturer: Samtec Inc.
BOARD TO BOARD & MEZZANINE CONNECTORS 2.00 MM FLEXYZ(TM) HIGH-DENSITY SQUARE TAIL SOCKET STRIP
| Part | Number of Rows | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions Loaded | Contact Type | Mounting Type | Contact Finish - Mating | Row Spacing - Mating | Contact Length - Post | Fastening Type | Contact Finish Thickness - Mating | Style | Pitch - Mating | Insulation Height | Connector Type | Termination | Contact Finish - Post | Number of Positions | Insulation Color | Insulation Material | Contact Shape | Contact Finish Thickness - Post | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 4 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.208 in | Push-Pull | 3 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 72 | Black | ||||
Samtec Inc. | 4 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.09 in | Push-Pull | 10 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 112 | Black | ||||
Samtec Inc. | 5 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.6 in | Push-Pull | 30 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 250 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |
Samtec Inc. | 4 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.208 in | Push-Pull | 3 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 80 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |
Samtec Inc. | 4 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.6 in | Push-Pull | 10 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 160 | Black | ||||
Samtec Inc. | 6 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.208 in | Push-Pull | 30 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 288 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |
Samtec Inc. | 5 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.208 in | Push-Pull | 30 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 55 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |
Samtec Inc. | 6 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.09 in | Push-Pull | 10 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 150 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |
Samtec Inc. | 6 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.6 in | Push-Pull | 10 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Gold | 150 | Black | ||||
Samtec Inc. | 4 | 125 °C | -55 °C | All | Forked | Through Hole | Gold | 0.079 in | 0.6 in | Push-Pull | 10 µin | Board | 0.079 in | 0.25 in | Socket | Solder | Tin | 176 | Black | Liquid Crystal Polymer (LCP) | Square | 50 µin | Phosphor Bronze |