
70-4021-1410
ActiveKester Solder
SOLDER PASTE NO CLEAN 500GM

70-4021-1410
ActiveKester Solder
SOLDER PASTE NO CLEAN 500GM
Description
General part information
70-4021 Series
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Technical Specifications
Parameters and characteristics for this part
| Specification | 70-4021-1410 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 17.64 oz |
| Melting Point (Max) | 424 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 50 °F |
| Storage/Refrigeration Temperature (Minimum) | 32 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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