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70-4021-0810

70-4021-1410

Active
Kester Solder

SOLDER PASTE NO CLEAN 500GM

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70-4021-0810

70-4021-1410

Active
Kester Solder

SOLDER PASTE NO CLEAN 500GM

Find alt

Description

General part information

70-4021 Series

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Technical Specifications

Parameters and characteristics for this part

Specification70-4021-1410
Ag Composition3 %
Composition ElementsCu, Sn, Ag
Composition FormulaSn96.5Ag3Cu0.5
Cu Composition0.5 %
FormJar
Form Weight17.64 oz
Melting Point (Max)424 °F
Melting Point (Min)423 °F
Mesh Type4
ProcessLead Free
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Shipping InfoShips with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Sn Composition96.5 %
Storage/Refrigeration Temperature (Maximum)50 °F
Storage/Refrigeration Temperature (Minimum)32 °F
TypeSolder Paste

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