70-4021 Series
Manufacturer: Kester Solder
Beta
⌘K
SOLDER PASTE NO CLEAN 600GM
| Part | Shipping Info | Ag Composition | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Form | Form Weight | Shelf Life Start | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Process | Type | Shelf Life | Melting Point (Max) | Melting Point (Min) | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Cartridge | 21.16 oz | Date of Manufacture | 50 °F | 32 °F | Lead Free | Solder Paste | 12 Months | 424 °F | 423 °F | 3 |
 Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Jar | 17.64 oz | Date of Manufacture | 50 °F | 32 °F | Lead Free | Solder Paste | 12 Months | 424 °F | 423 °F | 4 |
Kester Solder | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Cartridge | 24.69 oz | Date of Manufacture | 50 °F | 32 °F | Lead Free | Solder Paste | 12 Months | 424 °F | 423 °F | 3 | |
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Cartridge | 21.16 oz | Date of Manufacture | 50 °F | 32 °F | Lead Free | Solder Paste | 12 Months | 424 °F | 423 °F | 4 |
Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Jar | 17.64 oz | Date of Manufacture | 50 °F | 32 °F | Lead Free | Solder Paste | 12 Months | 424 °F | 423 °F | 3 |